The hottest IBM develops new processes to turn sil

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Recently, IBM announced that it has successfully developed a treatment technology for recyclable defective silicon wafers, that is, through this technology, the treated waste silicon wafers will be transformed into sucker rod tensile performance testing machines, and the standards used are those for the production of solar panels

as we all know, all kinds of electronic equipment need intact silicon chips. Once the silicon chips are found to have some defects, they will be discarded immediately. In the new process of IBM, some waste materials on the surface of silicon wafer will be treated by sandblasting process, and then processed by new technology. The final product is called "monitor"

Ericwhite, the inventor of this treatment process, introduced that the surface of silicon wafer needs a new process to be cleaned by adding water and sanding, and then placed in a clean environment for use. It takes only about 1 minute to complete the treatment of a silicon wafer with an investment range of 8 inches. These cleaned silicon chips can eventually be used in the production of solar cells. Eric also added that at present, the demand for silicon wafers in consumer electronics products is too large. IM can be used in pressure discs, turbine discs, blades, bearing rings, casings, fasteners and plate welded bearing parts of aircraft engines. B cannot fill this gap, so there is no plan to export this kind of silicon wafers to consumer electronics manufacturers for the time being

ibm's factory in Burlington has tried this process in 2006, and it can save IBM about $500000 each year, as shown in Figure 3. This year, IBM's plant in eastfishkill, New York, also began to apply this new processing technology. It is expected that this plant will save IBM more than 1.5 million dollars this year

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